By Qinghuang Lin, Raymond A. Pearson, Jeffrey C. Hedrick
Discusses patterning, insulating, and packaging polymeric fabrics for the $150-billion microelectronics in addition to the swiftly rising nanoelectronics and natural electronics industries. Chapters talk about patterning, insulating, and packaging polymeric fabrics in addition to natural fabrics for nanoelectronics, natural electronics, and optoelectronics. This e-book covers the synthesis, characterization, structure-property courting, functionality, and purposes of those materials.
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Additional resources for Polymers for Microelectronics and Nanoelectronics
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Thus, the precursor polymer can be coated onto many different types of surfaces or processed into various forms such as films andfibersbefore the crosslinking process. Since poly(la) was soluble in solvents such as chloroform (CHC1 ), methylene chloride (CH C1 ), and tetrahydrofuran (THF), and was insoluble in highly polar solvents such as water, alcohol, acetonitrile, a film of precursor polymer, poly(la), can be easily cast onto substrates such as glass from the solution in organic solvents, then crosslinked in acetonitrile.
27 those reported for carbon nanotubesfift) prepared by conventional methods. The value, however, is significantly lower than those for metal cones/J/j NANOPATTERNING OF PPV AND CARBON The main advantage of the present C V D polymerization of PPV is found in easy nanopatterning on conducting substrates including silicon wafers. For this purpose we utilized lithographed poly(methylmethacrylate) ( P M M A ) patterns on Si wafers. The C V D polymerization of PPV was performed on a P M M A pattern.