By E Moran

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CBMPBNENT 160. CBHPJiUEN ...... TENJUEN c;;;' 120 • • :IE: :IE:: ...... 0 O. 20. 0 Influence of die size on encapsulation stress. The magnitude of the encapsulation stress in a package is directly related to the molding temperature. In fact for every lOoC reduction in the molding temperature the compressive stress on the 8mm die in the 160 lead PQFP reduces by lON/mm 2 . However, because the transfer molding process is optimised with respect to many parameters including time, temperature, and viscosity, the molding temperature cannot be reduced on an arbitrary basis to reduce encapsulation stress.

Clearly plane stress conditions are not completely satisfied. 4 2D PLANE STRAIN APPROXIMATION TO A PQFP A plane strain approximation to the PQFP structure assumes that the model when cooled is prevented from contracting or deforming in the Z direction. The symmetry of the model indicates that any deformation in the X direction should be mirrored by a similar deformation in the Z direction. Plane strain conditions do not allow any deformation in the Z direction. Plane strain conditions are not completely satisfied.

4mm) results in a 16% increase in die stress. 19, lower material cost, and weight. 1) and must be encapsulated. 3 DIE PADDLE TCE The TCE of commonly used die paddle materials varies between about 4ppm/°C and 16ppm/°C. Simulations are undertaken to reflect this variation. The stress in the die varies linearly with the TCE of the die paddle. 3N/mm 2 . Increasing the TCE of the die paddle results in a small change in the tensile stress in the plastic above the die. 7. 4 DIE SIZE In the case of a 160 lead PQFP with a fixed body size and thickness, the effect of increasing the die size is to increase the die stress.

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